Qualcomm this week launched the “Snapdragon 865 and 765 Modular Platforms”, which are pre-engineered and pre-certified circuit boards that include most of the critical components for a high-end 5G phone (or equivalent cellular device.) As phones have become more sophisticated and refined, the costs of developing a competitive high-end phone have become prohibitive for all but the largest companies. This new program from Qualcomm aims to level that playing field for smaller companies. Verizon and Vodafone are participating in the program by pre-certifying the modules, making it easier for smaller companies to offer their high-end phones to some of the world’s largest carriers. HMD Global, maker of Nokia phones, indicated on stage at this week’s Qualcomm Snapdragon Summit that it plans to utilize the modules in its phones. At a Q-and-A session on Tuesday, Qualcomm President Cristiano Amon added that many companies attempting to engineer a high-end phone resort to stacking components to fit everything required into a phone body, often resulting in thermal issues. Qualcomm’s new modules are engineered as a single flat circuit board, offering better performance and enabling thinner designs.
Source: Phone Scoop – Latest News