Qualcomm today revealed the full details of its first Snapdragon chip with an integrated 5G modem, the Snapdragon 765. As its model number suggests, it offers better performance than the company’s 6-series chips that have previously been common to higher-end (but not “flagship”) phones in the US. In the Snapdragon lineup, the 765 sits just below the new flagship Snapdragon 865 chipset, also announced today. Unlike the 865, the 765 combines all of the processing cores together with the 5G modem on a single chip. This offers a smaller, more power-efficient, and more affordable solution compared to the 865, while still offering high-end performance. Qualcomm expects the 765 to help accelerate the adoption of 5G beyond expensive flagship devices. The Snapdragon 765 uses the latest 7nm manufacturing process — the same as the 865 — for better power efficiency. The 765’s integrated X52 5G modem supports download speeds up to 3.7 Gbps, (compared to 7.5 Gbps for the X55 in the Snapdragon 865,) but otherwise supports everything the company’s top-end 5G modems do, including both mmWave and sub-6 GHz frequency bands, SA and NSA modes, TDD and FDD, Dynamic Spectrum Sharing (DSS), global 5G roaming, and support for multi-SIM. The chip includes a new fast charging technology designed to extend the number of charges before a phone’s battery loses significant capacity. The 765 will also be available in a 765G variant with 20% better graphics performance, for gaming phones. The first phones powered by the Snapdragon 765 are expected to ship in the first quarter of 2020. Read on for additional details.
Source: Phone Scoop – Latest News